مؤتمر
Effect of Chip Layout in Wafer on Molding and Fan-Out Wafer Level Packaging (FO-WLP) Technology
| العنوان: | Effect of Chip Layout in Wafer on Molding and Fan-Out Wafer Level Packaging (FO-WLP) Technology |
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| المؤلفون: | Li, Yang, Ming, Xuefei, Ji, Yong, Wu, Xin, Gao, Nayan, Wang, Bo |
| المصدر: | 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :757-760 Aug, 2018 |
| Relation: | 2018 19th International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781538663868 9781538663851 |
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| DOI: | 10.1109/ICEPT.2018.8480791 |