مؤتمر
The application of HITCE ceramic material for LGA-type chip scale package
| العنوان: | The application of HITCE ceramic material for LGA-type chip scale package |
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| المؤلفون: | Maeda, K., Higashi, M., Kokubu, M., Nakagawa, S. |
| المصدر: | 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Electronic components and technology Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th. :358-363 2000 |
| Relation: | 2000 Proceedings. 50th Electronic Components and Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780359089 9780780359086 |
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| DOI: | 10.1109/ECTC.2000.853177 |