مؤتمر
Structural analysis and modelling of packaged light emitting devices by thermal transient measurements at multiple boundaries
العنوان: | Structural analysis and modelling of packaged light emitting devices by thermal transient measurements at multiple boundaries |
---|---|
المؤلفون: | Farkas, G., Poppe, A., Gaal, L., Hantos, G., Berenyi, Cs., Rencz, M. |
المصدر: | 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2018 24rd International Workshop on. :1-7 Sep, 2018 |
Relation: | 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) |
قاعدة البيانات: | IEEE Xplore Digital Library |
كن أول من يترك تعليقا!