مؤتمر
Evaluation of Heat Dissipation Performance of Printed Circuit Board Using JPCA Method in CFD Analysis
| العنوان: | Evaluation of Heat Dissipation Performance of Printed Circuit Board Using JPCA Method in CFD Analysis |
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| المؤلفون: | Hatakeyama, Tomoyuki, Kibushi, Risako, Suzuki, Koichi, Ishizuka, Masaru |
| المصدر: | 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2018 13th International. :97-100 Oct, 2018 |
| Relation: | 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781538656150 9781538656143 |
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| تدمد: | 21505942 |
| DOI: | 10.1109/IMPACT.2018.8625749 |