مؤتمر
Copper Trace Thermomechanical Reliability Analysis of Ball Grid Array Package
| العنوان: | Copper Trace Thermomechanical Reliability Analysis of Ball Grid Array Package |
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| المؤلفون: | Shih, S., Lee, M.Y., Liao, T.-W., Liu, D.S., Shih, M.-K., Tarng, D., Hung, C.P. |
| المصدر: | 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2018 13th International. :58-61 Oct, 2018 |
| Relation: | 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781538656150 9781538656143 |
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| تدمد: | 21505942 |
| DOI: | 10.1109/IMPACT.2018.8625799 |