مؤتمر
Active Device Performance after Fan-out Wafer-level Packaging Process
| العنوان: | Active Device Performance after Fan-out Wafer-level Packaging Process |
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| المؤلفون: | Li, H.-Y., Kawano, M., Lim, S., Cereno, D.I., Sekhar, V.N. |
| المصدر: | 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :495-499 Dec, 2018 |
| Relation: | 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781538676684 9781538676677 |
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| DOI: | 10.1109/EPTC.2018.8654434 |