التفاصيل البيبلوغرافية
| العنوان: |
Evaluation of Microscopic Strain Distribution of Low-Temperature Sintering Die Attach in Thermal Cycling Test |
| المؤلفون: |
Suzuki, Tomohisa, Yasuda, Yusuke, Terasaki, Takeshi, Morita, Toshiaki, Kawana, Yuki, Ishikawa, Dai, Nishimura, Masato, Nakako, Hideo, Kurafuchi, Kazuhiko, Matsuda, Tetsuya |
| المصدر: |
2018 20th International Conference on Electronic Materials and Packaging (EMAP) Electronic Materials and Packaging (EMAP), 2018 20th International Conference on. :1-4 Dec, 2018 |
| Relation: |
2018 20th International Conference on Electronic Materials and Packaging (EMAP) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
