مؤتمر
Test and evaluation of chip-to-chip attachment of MEMS devices
| العنوان: | Test and evaluation of chip-to-chip attachment of MEMS devices |
|---|---|
| المؤلفون: | Sandborn, P., Swaminathan, R., Subramanian, G., Deeds, M., Cochran, K. |
| المصدر: | ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on. 1:133-140 2000 |
| Relation: | ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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