مؤتمر
Incorporation of inorganic filler into the no-flow underfill material for flip-chip application
| العنوان: | Incorporation of inorganic filler into the no-flow underfill material for flip-chip application |
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| المؤلفون: | Lianhua Fan, Songhua Shi, Wong, C.P. |
| المصدر: | Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507) Advanced packaging materials: processes, properties and interfaces Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on. :303-310 2000 |
| Relation: | Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0930815599 9780930815592 |
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| DOI: | 10.1109/ISAPM.2000.869290 |