التفاصيل البيبلوغرافية
| العنوان: |
Electroplating of Through Silicon Vias: A Kinetic Monte Carlo Model |
| المؤلفون: |
MingRui, Lai, Hariharaputran, Ramanarayan, Khoo, Khoong Hong, Hongmei, Jin, Wu, Shunnian, Joshi, Chaitanya Amol, Mangipudi, Kodanda Ram, Quek, Siu Sin, Wu, David T., Narayanaswamy, Sridhar, Srinivasan, Bharathi Madurai |
| المصدر: |
2019 Electron Devices Technology and Manufacturing Conference (EDTM) Electron Devices Technology and Manufacturing Conference (EDTM), 2019. :342-344 Mar, 2019 |
| Relation: |
2019 Electron Devices Technology and Manufacturing Conference (EDTM) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
