مؤتمر
Warpage and Simulation Analysis of Panel Level FO-WLCSP Using Equivalent CTE
| العنوان: | Warpage and Simulation Analysis of Panel Level FO-WLCSP Using Equivalent CTE |
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| المؤلفون: | Liu, Shih-Wei, Tsai, Chia-Han, Chiang, Kuo-Ning |
| المصدر: | 2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :242-245 Apr, 2019 |
| Relation: | 2019 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9784990218874 |
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| DOI: | 10.23919/ICEP.2019.8733525 |