مؤتمر
Performance Evaluation of Liquid 3D Chip Cooling Systems Under Non-Uniform Power Density: Effects of Inlet and Plenum Configurations
| العنوان: | Performance Evaluation of Liquid 3D Chip Cooling Systems Under Non-Uniform Power Density: Effects of Inlet and Plenum Configurations |
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| المؤلفون: | Soleimanikutanaei, Soheil, Lin, Cheng-Xian, Pala, Nezih, Quan, Gang |
| المصدر: | 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019 18th IEEE Intersociety Conference on. :1260-1265 May, 2019 |
| Relation: | 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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