مؤتمر
Test-Cost Reduction for 2.5D ICs Using Microspring Technology for Die Attachment and Rework
| العنوان: | Test-Cost Reduction for 2.5D ICs Using Microspring Technology for Die Attachment and Rework |
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| المؤلفون: | Zhong, Zhanwei, Wrigglesworth, Tom B., Chow, Eugene M., Chakrabarty, Krishnendu |
| المصدر: | 2019 IEEE 37th VLSI Test Symposium (VTS) VLSI Test Symposium (VTS), 2019 IEEE 37th. :1-6 Apr, 2019 |
| Relation: | 2019 IEEE 37th VLSI Test Symposium (VTS) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781728111704 9781728111698 |
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| تدمد: | 23751053 |
| DOI: | 10.1109/VTS.2019.8758669 |