مؤتمر
Test-Cost Reduction for 2.5D ICs Using Microspring Technology for Die Attachment and Rework
العنوان: | Test-Cost Reduction for 2.5D ICs Using Microspring Technology for Die Attachment and Rework |
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المؤلفون: | Zhong, Zhanwei, Wrigglesworth, Tom B., Chow, Eugene M., Chakrabarty, Krishnendu |
المصدر: | 2019 IEEE 37th VLSI Test Symposium (VTS) VLSI Test Symposium (VTS), 2019 IEEE 37th. :1-6 Apr, 2019 |
Relation: | 2019 IEEE 37th VLSI Test Symposium (VTS) |
قاعدة البيانات: | IEEE Xplore Digital Library |
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