مؤتمر
A Single Bonding Process for Diverse Organic-Inorganic Integration in IoT Devices
| العنوان: | A Single Bonding Process for Diverse Organic-Inorganic Integration in IoT Devices |
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| المؤلفون: | Yang, Tilo H., Chiu, Yu-Shan, Yu, Hai-Yang, Shigetou, Akitsu, Kao, C. Robert |
| المصدر: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :235-242 May, 2019 |
| Relation: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781728114996 9781728114989 |
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| تدمد: | 23775726 |
| DOI: | 10.1109/ECTC.2019.00042 |