مؤتمر
The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics
| العنوان: | The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics |
|---|---|
| المؤلفون: | Phommahaxay, Alain, Kennes, Koen, Podpod, Arnita, Brems, Steven, Slabbekoorn, John, Sleeckx, Erik, Huyghebaert, Cedric, Asselberghs, Inge, Miller, Andy, Beyer, Gerald, Radu, Iuliana, Beyne, Eric, Guerrero, Alice, Prenger, Luke, Yess, Kim, Arnold, Kim, Tussing, Sebastian, Spiess, Walter, Rapps, Thomas, Lutter, Stefan |
| المصدر: | 2019 International Wafer Level Packaging Conference (IWLPC) Wafer Level Packaging Conference (IWLPC), 2019 International. :1-8 Oct, 2019 |
| Relation: | 2019 International Wafer Level Packaging Conference (IWLPC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
كن أول من يترك تعليقا!