Research on TSV Thermal-mechanical Reliability Based on Finite Element Analysis

التفاصيل البيبلوغرافية
العنوان: Research on TSV Thermal-mechanical Reliability Based on Finite Element Analysis
المؤلفون: Huang, Fangchao, Fan, Zhengwei, Chen, Xun, Liu, Yao, Zhang, Shufeng, Wang, Yashun, Jiang, Yu
المصدر: 2019 Prognostics and System Health Management Conference (PHM-Qingdao) Prognostics and System Health Management Conference (PHM-Qingdao), 2019. :1-8 Oct, 2019
Relation: 2019 Prognostics and System Health Management Conference (PHM-Qingdao)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781728108612
9781728108605
DOI:10.1109/PHM-Qingdao46334.2019.8942816