Characterization of Liquid Cooled Cold Plates for a Multi Chip Module (MCM) and their Impact on Data Center Chiller Operation

التفاصيل البيبلوغرافية
العنوان: Characterization of Liquid Cooled Cold Plates for a Multi Chip Module (MCM) and their Impact on Data Center Chiller Operation
المؤلفون: Ramakrishnan, Bharath, Tradat, Mohammad, Hadad, Yaser, Ghose, Kanad, Sammakia, Bahgat
المصدر: 2019 IEEE 17th International Conference on Industrial Informatics (INDIN) Industrial Informatics (INDIN), 2019 IEEE 17th International Conference on. 1:1419-1424 Jul, 2019
Relation: 2019 IEEE 17th International Conference on Industrial Informatics (INDIN)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781728129273
تدمد:2378363X
DOI:10.1109/INDIN41052.2019.8972030