مؤتمر
Foveros: 3D Integration and the use of Face-to-Face Chip Stacking for Logic Devices
| العنوان: | Foveros: 3D Integration and the use of Face-to-Face Chip Stacking for Logic Devices |
|---|---|
| المؤلفون: | Ingerly, D. B., Amin, S., Aryasomayajula, L., Balankutty, A., Borst, D., Chandra, A., Cheemalapati, K., Cook, C. S., Criss, R., Enamul, K., Gomes, W., Jones, D., Kolluru, K. C., Kandas, A., Kim, G.-S., Ma, H., Pantuso, D., Petersburg, C.F., Phen-givoni, M., Pillai, A. M., Sairam, A., Shekhar, P., Sinha, P., Stover, P., Telang, A., Zell, Z. |
| المصدر: | 2019 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2019 IEEE International. :19.6.1-19.6.4 Dec, 2019 |
| Relation: | 2019 IEEE International Electron Devices Meeting (IEDM) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder كن أول من يترك تعليقا!