A dual-stage algorithm to optimize the thermal placement of the smartphone multiple chips

التفاصيل البيبلوغرافية
العنوان: A dual-stage algorithm to optimize the thermal placement of the smartphone multiple chips
المؤلفون: Pang, Weiqiang, Ding, Jun, Kou, Dahe
المصدر: 2019 2nd International Conference on Information Systems and Computer Aided Education (ICISCAE) Information Systems and Computer Aided Education (ICISCAE), 2019 2nd International Conference on. :385-388 Sep, 2019
Relation: 2019 2nd International Conference on Information Systems and Computer Aided Education (ICISCAE)
قاعدة البيانات: IEEE Xplore Digital Library