مؤتمر
Heat conduction across Si/SiO2 and Diamond/Si interfaces using DPL model related to temperature jump boundary condition
| العنوان: | Heat conduction across Si/SiO2 and Diamond/Si interfaces using DPL model related to temperature jump boundary condition |
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| المؤلفون: | Houssem, Rezgui, Faouzi, Nasri, Fadhel, Ben Aissa Mohamed, Allah, Guizani Amen |
| المصدر: | 2018 IEEE International Conference on Smart Materials and Spectroscopy (SMS) Smart Materials and Spectroscopy (SMS), 2018 IEEE International Conference on. :23-27 Oct, 2018 |
| Relation: | 2018 IEEE International Conference on Smart Materials and Spectroscopy (SMS) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781538671832 9781538671825 |
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| DOI: | 10.1109/SMS44485.2018.9101393 |