التفاصيل البيبلوغرافية
| العنوان: |
Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill |
| المؤلفون: |
Lesniewska, A., Roussel, P.J., Tierno, D., Gonzalez, V. Vega, van der Veen, M. H., Verdonck, P., Jourdan, N., Wilson, C.J., Tokei, Zs., Croes, K. |
| المصدر: |
2020 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2020 IEEE International. :1-6 Apr, 2020 |
| Relation: |
2020 IEEE International Reliability Physics Symposium (IRPS) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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