التفاصيل البيبلوغرافية
| العنوان: |
Pressureless transient liquid phase sintering bonding using SAC305 with hybrid Ag particles for high–temperature packaging applications |
| المؤلفون: |
Hwang, Byeong-Uk, Min, Kyung Deuk, Jung, Kwang-Ho, Lee, Choong-Jae, Kim, Jae-Ha, Jung, Seung-Boo |
| المصدر: |
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1855-1860 Jun, 2020 |
| Relation: |
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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