التفاصيل البيبلوغرافية
العنوان: |
Pressureless transient liquid phase sintering bonding using SAC305 with hybrid Ag particles for high–temperature packaging applications |
المؤلفون: |
Hwang, Byeong-Uk, Min, Kyung Deuk, Jung, Kwang-Ho, Lee, Choong-Jae, Kim, Jae-Ha, Jung, Seung-Boo |
المصدر: |
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1855-1860 Jun, 2020 |
Relation: |
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |