مؤتمر
Trench Isolation Technology for Cost-effective Wafer-level 3D Integration with One-step TSV
| العنوان: | Trench Isolation Technology for Cost-effective Wafer-level 3D Integration with One-step TSV |
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| المؤلفون: | Kawano, Masaya, Wang, Xiang-Yu, Ren, Qin |
| المصدر: | 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1161-1166 Jun, 2020 |
| Relation: | 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781728161808 |
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| تدمد: | 23775726 |
| DOI: | 10.1109/ECTC32862.2020.00186 |