مؤتمر
Effect of annealing on the toughness of 40-μm-wide nanotwinned Cu lines
| العنوان: | Effect of annealing on the toughness of 40-μm-wide nanotwinned Cu lines |
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| المؤلفون: | Hsu, Wei-You, Li, Yu-Jin, Tseng, I-Hsin, Lin, Benson Tzu-Hung, Chang, Chia-Cheng, Chen, Chih |
| المصدر: | 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :906-911 Jun, 2020 |
| Relation: | 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781728161808 |
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| تدمد: | 23775726 |
| DOI: | 10.1109/ECTC32862.2020.00148 |