مؤتمر
Turbulent Flows Impinging on High Power Multi-Chip Bare Die Package
| العنوان: | Turbulent Flows Impinging on High Power Multi-Chip Bare Die Package |
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| المؤلفون: | Subrahmanyam, Prabhakar, Pang, Ying-feng |
| المصدر: | 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :2058-2065 Jun, 2020 |
| Relation: | 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781728161808 |
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| تدمد: | 23775726 |
| DOI: | 10.1109/ECTC32862.2020.00319 |