التفاصيل البيبلوغرافية
| العنوان: |
A Study on the Mechanical Debonding Process through Static-Elastic Stress Analysis for 3-D Wafer Level Packages (WLPs) |
| المؤلفون: |
Lee, Hyeong-Gi, Kim, Dae-Sung, Cho, Jung-Hyun, Lee, Jung-Hyuk, Park, Jae-Yong, Kim, Min-Ho, Lee, Jae-Wook |
| المصدر: |
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :303-308 Jun, 2020 |
| Relation: |
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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