Reliability Demonstration of Reflow Qualified 22nm STT-MRAM for Embedded Memory Applications

التفاصيل البيبلوغرافية
العنوان: Reliability Demonstration of Reflow Qualified 22nm STT-MRAM for Embedded Memory Applications
المؤلفون: Wang, Chia-Yu, Shih, Meng-Chun, Weng, Chih-Hui, Chen, Chia-Hsiang, Chang, Chih-Yang, Wang, Wayne, Chiang, Tien-Wei, Hung, Arthur, Chuang, Harry, Gallagher, William J.
المصدر: 2020 IEEE Symposium on VLSI Technology VLSI Technology, 2020 IEEE Symposium on. :1-2 Jun, 2020
Relation: 2020 IEEE Symposium on VLSI Technology
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781728164601
تدمد:21589682
DOI:10.1109/VLSITechnology18217.2020.9265054