مؤتمر
Reliability Demonstration of Reflow Qualified 22nm STT-MRAM for Embedded Memory Applications
العنوان: | Reliability Demonstration of Reflow Qualified 22nm STT-MRAM for Embedded Memory Applications |
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المؤلفون: | Wang, Chia-Yu, Shih, Meng-Chun, Weng, Chih-Hui, Chen, Chia-Hsiang, Chang, Chih-Yang, Wang, Wayne, Chiang, Tien-Wei, Hung, Arthur, Chuang, Harry, Gallagher, William J. |
المصدر: | 2020 IEEE Symposium on VLSI Technology VLSI Technology, 2020 IEEE Symposium on. :1-2 Jun, 2020 |
Relation: | 2020 IEEE Symposium on VLSI Technology |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781728164601 |
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تدمد: | 21589682 |
DOI: | 10.1109/VLSITechnology18217.2020.9265054 |