مؤتمر
Temporary Bonding and De-bonding Process for 2.5D/3D Applications
| العنوان: | Temporary Bonding and De-bonding Process for 2.5D/3D Applications |
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| المؤلفون: | Ren, Qin, Loh, Woon Leng, Neo, Siang Kiat, Chui, King-Jien |
| المصدر: | 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :27-31 Dec, 2020 |
| Relation: | 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781728189116 9781728189109 |
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| DOI: | 10.1109/EPTC50525.2020.9315033 |