The Overview of Current Interconnect Technology Challenges and Future Opportunities

التفاصيل البيبلوغرافية
العنوان: The Overview of Current Interconnect Technology Challenges and Future Opportunities
المؤلفون: Lee, M.H., Shue, Winston S.
المصدر: 2020 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2020 IEEE International. :32.1.1-32.1.4 Dec, 2020
Relation: 2020 IEEE International Electron Devices Meeting (IEDM)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781728188881
تدمد:2156017X
DOI:10.1109/IEDM13553.2020.9372053