مؤتمر
The Overview of Current Interconnect Technology Challenges and Future Opportunities
العنوان: | The Overview of Current Interconnect Technology Challenges and Future Opportunities |
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المؤلفون: | Lee, M.H., Shue, Winston S. |
المصدر: | 2020 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2020 IEEE International. :32.1.1-32.1.4 Dec, 2020 |
Relation: | 2020 IEEE International Electron Devices Meeting (IEDM) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781728188881 |
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تدمد: | 2156017X |
DOI: | 10.1109/IEDM13553.2020.9372053 |