The Overview of Current Interconnect Technology Challenges and Future Opportunities

التفاصيل البيبلوغرافية
العنوان: The Overview of Current Interconnect Technology Challenges and Future Opportunities
المؤلفون: Lee, M.H., Shue, Winston S.
المصدر: 2020 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2020 IEEE International. :32.1.1-32.1.4 Dec, 2020
Relation: 2020 IEEE International Electron Devices Meeting (IEDM)
قاعدة البيانات: IEEE Xplore Digital Library