Chip to Package Interaction Risk Assessment of FCBGA Devices using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique

التفاصيل البيبلوغرافية
العنوان:	Chip to Package Interaction Risk Assessment of FCBGA Devices using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique
المؤلفون:	Lee, Moon Soo, Baick, Inhak, Kim, Min, Kwon, Seo Hyun, Yeo, Myeong Soo, Rhee, Hwasung, Lee, Euncheol
المصدر:	2021 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2021 IEEE International. :1-6 Mar, 2021
Relation:	2021 IEEE International Reliability Physics Symposium (IRPS)
قاعدة البيانات:	IEEE Xplore Digital Library