دورية أكاديمية
3-D Prismatic Packaging Methodologies for Wide Band Gap Power Electronics Modules
| العنوان: | 3-D Prismatic Packaging Methodologies for Wide Band Gap Power Electronics Modules |
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| المؤلفون: | Ke, H., Mehrotra, U., Hopkins, D.C. |
| المصدر: | IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 36(11):13057-13066 Nov, 2021 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 08858993 19410107 |
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| DOI: | 10.1109/TPEL.2021.3081679 |