التفاصيل البيبلوغرافية
| العنوان: |
Design optimization of copper patterns and location of power semiconductors and terminals |
| المؤلفون: |
Abe, Yusuke, Hirao, Akira, Kato, Ryoichi, Ikeda, Yoshinari, Parque, Victor, Faiz, Muhammad Khairi, Yoshida, Makoto, Miyashita, Tomoyuki |
| المصدر: |
2021 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2021 International Conference on. :157-158 May, 2021 |
| Relation: |
2021 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
