التفاصيل البيبلوغرافية
| العنوان: |
Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding |
| المؤلفون: |
Iacovo, Serena, Peng, Lan, Nagano, Fuya, Uhrmann, Thomas, Burggraf, Jurgen, Fehkuhrer, Andreas, Conard, Thierry, Inoue, Fumihiro, Kim, Soon-Wook, De Vos, Joeri, Phommahaxay, Alain, Beyne, Eric |
| المصدر: |
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :2097-2104 Jun, 2021 |
| Relation: |
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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