التفاصيل البيبلوغرافية
العنوان: |
Investigation of Wet Pretreatment to Improve Cu-Cu Bonding for Hybrid Bonding Applications |
المؤلفون: |
Hung, Tzu-Heng, Kang, Ting-Cih, Mao, Shan-Yu, Chou, Tzu-Chieh, Hu, Han-Wen, Chiu, Hsih-Yang, Shih, Chiang-Lin, Chen, Kuan-Neng |
المصدر: |
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :700-705 Jun, 2021 |
Relation: |
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |