مؤتمر
Investigation of Wet Pretreatment to Improve Cu-Cu Bonding for Hybrid Bonding Applications
| العنوان: | Investigation of Wet Pretreatment to Improve Cu-Cu Bonding for Hybrid Bonding Applications |
|---|---|
| المؤلفون: | Hung, Tzu-Heng, Kang, Ting-Cih, Mao, Shan-Yu, Chou, Tzu-Chieh, Hu, Han-Wen, Chiu, Hsih-Yang, Shih, Chiang-Lin, Chen, Kuan-Neng |
| المصدر: | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :700-705 Jun, 2021 |
| Relation: | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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