Multi-Stack Wafer Bonding Demonstration utilizing Cu to Cu Hybrid Bonding and TSV enabling Diverse 3D Integration

التفاصيل البيبلوغرافية
العنوان:	Multi-Stack Wafer Bonding Demonstration utilizing Cu to Cu Hybrid Bonding and TSV enabling Diverse 3D Integration
المؤلفون:	Kim, TaeSeong, Cho, Sohye, Hwang, SeonKwan, Lee, Kyuha, Hong, Yikoan, Lee, Hakseung, Cho, Hyokyung, Moon, Kwangjin, Na, Hoonjoo, Hwang, Kihyun
المصدر:	2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :415-419 Jun, 2021
Relation:	2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library