مؤتمر
One-step TSV process development for 4-layer wafer stacked DRAM
| العنوان: | One-step TSV process development for 4-layer wafer stacked DRAM |
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| المؤلفون: | Kawano, Masaya, Wang, Xiang-Yu, Ren, Qin, Loh, Woon-Leng, Rao, BSS. Chandra, Chui, King-Jien |
| المصدر: | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :673-679 Jun, 2021 |
| Relation: | 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781665440974 |
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| تدمد: | 23775726 |
| DOI: | 10.1109/ECTC32696.2021.00117 |