مؤتمر
Electrically Conductive Adhesive Interconnections on Additively Printed Substrates
| العنوان: | Electrically Conductive Adhesive Interconnections on Additively Printed Substrates |
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| المؤلفون: | Lall, Pradeep, Goyal, Kartik, Schulze, Kyle, Miller, Scott |
| المصدر: | 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021 20th IEEE Intersociety Conference on. :807-817 Jun, 2021 |
| Relation: | 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781728185392 9781728185385 |
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| تدمد: | 26942135 |
| DOI: | 10.1109/ITherm51669.2021.9503235 |