التفاصيل البيبلوغرافية
| العنوان: |
Mechanical Properties of Low-k Dielectric Deposited on Subtractively Patterned Cu Lines for Advanced Interconnects |
| المؤلفون: |
Ovchinnikov, I. S., Seregin, D. S., Abdullaev, D. A., Vorotilov, K. A., Rezvanov, A. A., Gvozdev, V. A., Blomberg, T., Veselov, A. A., Baklanov, M. R. |
| المصدر: |
2021 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2021 IEEE International. :1-3 Jul, 2021 |
| Relation: |
2021 IEEE International Interconnect Technology Conference (IITC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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