In-situ CMP copper endpoint control system

التفاصيل البيبلوغرافية
العنوان: In-situ CMP copper endpoint control system
المؤلفون: Allen, R., Chen, C., Trikas, T., Lehman, K., Shinagawa, R., Bhaskaran, V., Stephenson, B., Watts, D.
المصدر: 2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203) Semiconductor manufacturing Semiconductor Manufacturing Symposium, 2001 IEEE International. :391-394 2001
Relation: 2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:0780367316
9780780367319
DOI:10.1109/ISSM.2001.962997