Middle-of-the-Line Reliability Characterization of Recessed-Diffusion-Contact Adopted sub-5nm Logic Technology

التفاصيل البيبلوغرافية
العنوان:	Middle-of-the-Line Reliability Characterization of Recessed-Diffusion-Contact Adopted sub-5nm Logic Technology
المؤلفون:	Kim, Seongkyung, Jung, Ukjin, Choo, Seungjin, Choi, Kihyun, Chung, Taejin, Chung, Shinyoung, Lee, Euncheol, Park, Juhun, Bae, Deokhan, Um, Myungyoon
المصدر:	2022 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2022 IEEE International. :11A.1-1-11A.1-7 Mar, 2022
Relation:	2022 IEEE International Reliability Physics Symposium (IRPS)
قاعدة البيانات:	IEEE Xplore Digital Library