مؤتمر
Innovative Practices Track: Test of 3D ICs & Chiplets
| العنوان: | Innovative Practices Track: Test of 3D ICs & Chiplets |
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| المؤلفون: | Goel, Sandeep Kumar, Pendharkar, Sandeep, Liu, Chunsheng |
| المصدر: | 2022 IEEE 40th VLSI Test Symposium (VTS) VLSI Test Symposium (VTS), 2022 IEEE 40th. :1-1 Apr, 2022 |
| Relation: | 2022 IEEE 40th VLSI Test Symposium (VTS) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781665410601 9781665410595 |
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| تدمد: | 23751053 |
| DOI: | 10.1109/VTS52500.2021.9794242 |