التفاصيل البيبلوغرافية
| العنوان: |
Voids in First-Level Interconnects and Their Impact on Solder Joint Reliability |
| المؤلفون: |
Lee, Kor Oon, Oi, Kiyoshi, Lim, Sze Pei, Yeo, Yvonne, Sweatman, Keith, Ono, Toshiaki, Murayama, Kei, Martell, Steven R., Shimamoto, Haruo, Tsuriya, Masahiro |
| المصدر: |
2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :5-6 May, 2022 |
| Relation: |
2022 International Conference on Electronics Packaging (ICEP) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
