التفاصيل البيبلوغرافية
| العنوان: |
Mold Flow Analysis and Optimization in Injection Molding Process for Semiconductor Packages |
| المؤلفون: |
Huang, Jinxin, Huang, Xiaomeng, Shi, Kaijie, Cheng, Xiuqing, Jiang, Yan |
| المصدر: |
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022 |
| Relation: |
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
