مؤتمر
Forward design research on the warpage of baseplate for IGBT module
| العنوان: | Forward design research on the warpage of baseplate for IGBT module |
|---|---|
| المؤلفون: | Chang, Guiqin, Fang, Chao, Tang, Xiang, Luo, Haihui, Shi, Tingchang, Yu, Jun |
| المصدر: | 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022 |
| Relation: | 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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