مؤتمر
The Optimal Solution of Reflow Oven Recipe based on Physics-guided Machine Learning Model
| العنوان: | The Optimal Solution of Reflow Oven Recipe based on Physics-guided Machine Learning Model |
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| المؤلفون: | Lai, Yangyang, Pan, Ke, Ha, Jonghwan, Cai, Chongyang, Yang, Junbo, Yin, Pengcheng, Xu, Jiefeng, Park, Seungbae |
| المصدر: | 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-6 May, 2022 |
| Relation: | 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781665485036 9781665485029 |
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| تدمد: | 26942135 |
| DOI: | 10.1109/iTherm54085.2022.9899644 |