التفاصيل البيبلوغرافية
| العنوان: |
Case Study For STI-LDNMOS Burned During HCI Stress to Passing Reliability Specifications |
| المؤلفون: |
Chu, Wei-Cheng, Tsai, Bo-An, Yoshida, Hiroshi, Chen, Yi-Heng, Hsu, Yung-Lung |
| المصدر: |
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2022 IEEE International Symposium on the. :1-4 Jul, 2022 |
| Relation: |
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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