دورية أكاديمية
Microstructure Observation, Accumulated Equivalent Stress, and Creep Strain Simulation of SPD Disconnector Solder Joint Based on Isothermal Aging
العنوان: | Microstructure Observation, Accumulated Equivalent Stress, and Creep Strain Simulation of SPD Disconnector Solder Joint Based on Isothermal Aging |
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المؤلفون: | Zhou, Q., Cao, T., Liu, Y., Huang, X., Bian, X. |
المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(11):1771-1780 Nov, 2022 |
قاعدة البيانات: | IEEE Xplore Digital Library |
تدمد: | 21563950 21563985 |
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DOI: | 10.1109/TCPMT.2022.3216916 |